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CD40102BPW is listed in the Counter Dividers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BCD COUNTER DL 4BIT 16TSSOP. Review the specifications below when checking this part for your BOM.
The CD40102BPW is a CMOS integrated circuit from the Texas Instruments CD4000B series, housed in a 16-pin TSSOP package. It functions as an 8-stage synchronous down counter configured as two cascaded 4-bit BCD counters. The device features active-low control inputs for clock enable, asynchronous clear, and synchronous or asynchronous preset capabilities. It operates within a supply voltage range of 3 V to 18 V and supports a typical clock frequency of 3.6 MHz at 10 V. The component includes a zero-detect output that activates when the internal count reaches zero.
Verify the specific suffix 'PW' confirms the TSSOP-16 surface-mount package variant rather than through-hole options. Confirm RoHS compliance status and check for any recent Product Change Notifications regarding pinout or electrical parameter updates. Ensure the supplier provides original manufacturer documentation to validate authenticity before procurement.
Select this component when a dual-decade BCD counting function is required in a compact surface-mount form factor. It is suitable for designs needing synchronous presetting and zero-detection outputs. Consider the 3 V to 18 V operating range for compatibility with various logic levels. Verify that the 3.6 MHz typical clock speed meets the system timing requirements.
This part belongs to the CD4000B series of high-voltage CMOS devices, standardized under JEDEC Tentative Standard No. 13B. It is functionally related to the CD40102BMS, which shares similar counting architecture but differs in packaging. The series is characterized by medium-speed operation and low input current specifications across full temperature ranges.
The CD40102BNSR is a verified substitute offering identical functionality in an SOP-16 package. Other compatible variants include the CD40102BE for through-hole applications. Ensure mechanical footprint differences are accounted for during board redesign.
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