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The CD40174BD3 is a six-bit D-type flip-flop manufactured by Harris Corporation. It operates within the CMOS logic family and utilizes a positive edge-triggered mechanism for data storage. The component is housed in a 16-lead ceramic dual in-line package (CDIP) with a 0.300-inch width. Designed for robust performance, it supports an operating temperature range from -55°C to +125°C. The device functions as a single-element memory unit suitable for digital signal processing applications requiring reliable state retention.
Verify that the specific part number matches the required ceramic package variant. Confirm compliance with export control regulations due to military-grade specifications. Ensure the supplier provides documentation confirming the non-RoHS status if environmental compliance is a constraint for the final assembly. Validate the lead frame material and seal integrity for high-reliability environments.
Select this component when a six-bit parallel data register is required in harsh environments. The ceramic package offers superior hermeticity compared to plastic alternatives. Consider the positive edge-triggering characteristic for timing synchronization. Evaluate the extended temperature range against the operational thermal profile of the target system to ensure long-term reliability.
This component belongs to the standard CMOS logic series produced by Harris Corporation. It serves as a fundamental building block for sequential logic circuits. The CDIP package indicates a heritage design intended for high-reliability aerospace or defense applications. It complements other logic gates within the same family for complex digital system construction.
Direct substitutes include the CD40174BM from Texas Instruments. Verify pin compatibility and electrical characteristics before substitution. Ensure the replacement package matches the physical footprint requirements of the existing design.