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The CD40174BPWR is a hex D-type flip-flop manufactured by Texas Instruments, belonging to the 4000B CMOS logic series. It features six independent positive-edge-triggered D-type flip-flops with non-inverting outputs within a single integrated circuit. The device operates on a supply voltage range of 3V to 18V and supports a maximum clock frequency of 16 MHz. It includes a master reset function for synchronous clearing of all flip-flops. The component is housed in a 16-TSSOP surface-mount package with a width of 4.40mm. It is designed for industrial temperature ranges from -55°C to 125°C.
Verify the specific ordering suffix to confirm the tape and reel packaging configuration, as standard designations may vary between cut tape and full reel quantities. Ensure the procurement channel provides valid traceability documentation for the 4000B series component. Confirm that the received units match the active manufacturing status indicated in official distributor catalogs before finalizing acquisition orders.
Select this component when a compact solution for multiple synchronized storage elements is required in low-power CMOS designs. The TSSOP package offers space efficiency for surface-mount assemblies compared to through-hole alternatives. Consider the 16 MHz maximum clock speed limitation when designing high-frequency signal processing paths. Evaluate the master reset functionality requirements against alternative latch types for optimal state management.
This part belongs to the Texas Instruments 4000B series of CMOS logic devices, which are widely used in general-purpose digital electronics. The CD40174 specifically addresses the need for multi-bit storage within a single package, reducing board space compared to discrete flip-flop implementations. It complements other series components like counters and decoders for complete digital logic system construction.
The CD40174BPW is listed as a direct substitute offering identical electrical characteristics and pinout compatibility. Verify package dimension tolerances when transitioning between reel and tube packaging variants to ensure mechanical fit within existing PCB footprints.