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CD4047BCN is listed in the Multivibrators range at ChipApex. The manufacturer field lists onsemi. Its product description is IC MULTIVIBRATOR 80NS 14DIP. Review the specifications below when checking this part for your BOM.
The CD4047BC is a low-power CMOS monostable/astable multivibrator manufactured by Fairchild Semiconductor. It operates in either mode using one external resistor and capacitor. The device supports positive or negative edge triggering, retriggerable operation, and free-running or gatable astable modes. It features true and complemented buffered outputs and an oscillator output with double frequency. Recommended operating conditions specify a DC supply voltage range of 3V to 15V and an operating temperature range from -55°C to +125°C.
Verify the package type matches the specific suffix; 'N' indicates a 14-lead Plastic Dual-In-Line Package (PDIP). Confirm RoHS compliance status as manufacturing revisions may affect lead-free specifications. Ensure the ordering code includes the correct suffix if tape and reel packaging is required instead of tube. Check for any specific environmental certifications needed for the target application.
Select this component when a versatile timing solution requiring minimal external components is necessary. The CD4047BC is suitable for designs needing both monostable and astable functionality within a single IC. Consider the wide supply voltage range and temperature stability for industrial environments. Verify that the output drive current meets the load requirements before finalizing the design.
This part belongs to the 4000 series of CMOS logic devices, known for wide voltage operation and low power. The CD4047BC specifically addresses timing generation needs where flexibility between one-shot and free-running modes is required. It serves as a foundational component in analog-digital interface circuits and signal processing systems.
Compatible substitutes include the CD4047B from other manufacturers such as Texas Instruments or Renesas, provided pinouts and electrical characteristics align. Verify that alternative packages like SOIC or ceramic DIP meet mechanical constraints. Ensure functional equivalence in trigger sensitivity and output drive capabilities.
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