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CD4086BPWR is listed in the Gates And Inverters - Multi-Function, Configurable range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC EXPND AND-ORINV GATE 14TSSOP. Review the specifications below when checking this part for your BOM.
The CD4086BPWR is a CMOS logic integrated circuit manufactured by Texas Instruments, belonging to the CD4000B series. It functions as an expandable 4-wide 2-input AND-OR-INVERT gate housed in a 14-pin TSSOP surface-mount package. The device operates within a supply voltage range of 3 V to 18 V and supports a wide operating temperature range from -55 °C to +125 °C. Key electrical characteristics include a low-level output current of 1.5 mA and a high-level output current of -1.5 mA. Propagation delay is specified at 12 ns under standard conditions.
Verify the specific suffix 'PWR' confirms the TSSOP-14 package variant when sourcing. Ensure compatibility with 3V to 18V supply rails during design integration. Confirm RoHS compliance status matches project requirements. Validate that the manufacturer designation aligns with Texas Instruments specifications for the CD4000B series.
Select this component when a compact surface-mount solution for complex AND-OR-INVERT logic is required. The TSSOP-14 package offers space efficiency compared to traditional DIP formats. Consider the 12 ns propagation delay for timing-sensitive applications. Verify that the expandable feature meets system scalability needs without adding external gating hardware.
This part belongs to the Texas Instruments CD4000B family of CMOS digital logic devices. The CD4086B specifically provides a versatile logic structure often used in arithmetic and control applications. The 'PWR' suffix denotes the plastic small-outline package type, distinguishing it from other physical form factors available within the same logical function family.
CD4086BPWG4: Lead-free version with identical electrical specifications and pinout. CD4086BPWRE4: Environmental compliant variant maintaining functional equivalence. Verify package dimensions and thermal characteristics match existing board layouts before substitution.
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