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CD4511BEE4 is listed in the Display Drivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is CMOS BCD-TO-7-SEGMENT LED LATCH. Review the specifications below when checking this part for your BOM.
The CD4511BEE4 is a BCD-to-7-segment decoder/driver manufactured by Texas Instruments, belonging to the 4500 series of CMOS logic devices. It features a single circuit with four input lines and seven output lines designed for driving common-cathode displays. The component operates within a supply voltage range of 3 V to 18 V and supports through-hole mounting in a DIP-16 package. It functions effectively across an extended temperature range from -55 °C to +125 °C, ensuring reliable performance in industrial environments.
Verify the specific ordering suffix 'E4' confirms lead-free status and RoHS compliance as per manufacturer specifications. Confirm that the DIP-16 package type matches the target PCB footprint requirements. Ensure the application design accounts for the maximum supply voltage limits and operating temperature ranges defined in the official datasheet to guarantee long-term reliability.
Select this component when a robust, wide-voltage CMOS decoder is required for legacy or industrial systems. The DIP-16 package facilitates easy prototyping and manual assembly compared to surface-mount alternatives. Consider the 4500 series characteristics regarding speed and power consumption relative to HC or HCT logic families for compatible system integration.
This device is part of the extensive CD4500 series of CMOS logic integrated circuits produced by Texas Instruments. The CD4511 variant specifically addresses the need for decoding binary information into human-readable numeric formats. Its inclusion in the product line highlights the manufacturer's focus on providing versatile solutions for display interfacing in general-purpose electronic applications.
The CD4511BE serves as the standard non-compliant equivalent. Other variants within the same family may offer different packaging options such as SOIC or TSSOP while maintaining identical logical functionality.
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