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Product Detailed Parameters
- Description：DIODE STANDARD 200V 200MA DIE
- Series：-
- Mfr：Microchip Technology
- Package：Tape & Reel (TR)
- Technology：Standard
- Voltage - DC Reverse (Vr) (Max)：200 V
- Current - Average Rectified (Io)：200mA
- Voltage - Forward (Vf) (Max) @ If：1 V @ 100 mA
- Speed：Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr)：-
- Current - Reverse Leakage @ Vr：25 nA @ 180 V
- Capacitance @ Vr, F：-
- Mounting Type：Surface Mount
- Package / Case：Die
- Supplier Device Package：Die
- Operating Temperature - Junction：-65°C ~ 175°C
- Grade：-
- Qualification：-
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Overview
The CD485B is a general-purpose silicon signal diode manufactured by Microsemi, now part of Microchip Technology. It features a single rectifier diode element constructed from silicon material. The device is supplied as an uncased chip die in a DIE-2 package configuration with two terminals. It is designed for robust operation within an operating and storage temperature range of -65°C to +175°C. The junctions are completely protected with silicon dioxide. The component supports standard wire bonding and die attach techniques, excluding solder reflow processes.
Feature Summary
- Junctions are completely protected with silicon dioxide for enhanced reliability.
- Compatible with all standard wire bonding and die attach techniques except solder reflow.
- Designed for high-temperature operation up to +175°C.
Applications
- General purpose rectification in silicon circuits
- High-temperature electronic environments
Procurement Notes
Verify the manufacturer designation carefully, as the component is historically associated with Microsemi, which has been acquired by Microchip Technology. Confirm the specific package code DIE-2 and terminal count match your assembly requirements. Ensure that the exclusion of solder reflow compatibility is accounted for in your manufacturing process flow. Check for lead content and RoHS compliance status prior to integration.
Selection Notes
Select this component when a ruggedized silicon signal diode capable of withstanding extreme temperatures is required. The uncased die format necessitates specific handling and attachment methods compatible with wire bonding. Consider the voltage ratings relative to the circuit requirements, noting variations across the CD483B/CD485B/CD486B series. Ensure the design accommodates the absence of solder reflow compatibility during assembly.
Part Context
The CD485B belongs to a family of general-purpose silicon diodes that includes variants such as the CD483B, CD486B, CD645, and CD5194 through CD5196. These components share common construction features like silicon dioxide protection and high-temperature tolerance but differ in peak voltage and current specifications. This series is intended for applications requiring reliable signal rectification under harsh thermal conditions.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Variants within the same series, such as CD483B or CD486B, may offer different electrical characteristics and should be evaluated for functional equivalence before substitution.
