CD5195

CD5195

$4.36
  • Description:DIODE STANDARD 200V 200MA DIE
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tape & Reel (TR)

SKU:da2ee8703bed Category: Brand:

  
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Product Detailed Parameters

  • Description:DIODE STANDARD 200V 200MA DIE
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tape & Reel (TR)
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):200 V
  • Current - Average Rectified (Io):200mA
  • Voltage - Forward (Vf) (Max) @ If:1 V @ 100 mA
  • Speed:Small Signal =< 200mA (Io), Any Speed
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:25 nA @ 200 V
  • Capacitance @ Vr, F:-
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Operating Temperature - Junction:-65°C ~ 175°C
  • Grade:-
  • Qualification:-

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CD5195

Overview

The CD5195 is a general-purpose silicon diode die manufactured by Microchip Technology. It is designed for surface mount applications and operates with a maximum reverse voltage of 200V and a forward current rating of 200mA. The component is classified as a signal or computer diode, suitable for rectification and switching tasks in electronic circuits.

Feature Summary

  • Surface mount die configuration for compact integration
  • General-purpose silicon construction
  • Rated for 200V reverse voltage operation
  • Capable of handling 200mA forward current

Applications

  • Signal rectification circuits
  • Computer logic interface protection
  • General purpose switching applications

Procurement Notes

Verify the specific datasheet version from Microchip Technology to confirm electrical characteristics and handling instructions. Ensure compatibility with surface mount assembly processes. Confirm that the die form factor meets the mechanical constraints of the target printed circuit board design before finalizing procurement.

Selection Notes

Select this component when a small form factor surface mount diode is required for low-current switching or rectification. The 200V rating provides sufficient margin for many standard logic and signal levels. Consider the die package type carefully as it requires specific mounting techniques compared to standard leaded packages.

Part Context

This part belongs to the single diode category within Microchip's semiconductor portfolio. It serves as a discrete solution for basic rectification needs where integrated circuits are not necessary. The die format allows for custom packaging or direct bonding in specialized modules.

Replacement Considerations

Check for equivalent general-purpose silicon diodes with matching 200V and 200mA ratings. Surface mount equivalents such as SOD-323 or similar small outline diodes may be considered if the die form factor is incompatible with the assembly process.

CD5195CD5195
$4.36
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