CD5196

Overview

The CD5196 is a general-purpose switching diode die manufactured by Microchip Technology. It features a maximum repetitive peak reverse voltage of 250 V and a maximum average forward rectified current of 200 mA. The device is supplied as a bare die in surface mount configuration, designed for integration into custom semiconductor assemblies or hybrid circuits requiring high-speed switching capabilities.

Feature Summary

• High-voltage blocking capability suitable for demanding signal applications
• Compact bare die form factor enabling dense circuit integration
• Optimized for fast switching performance in computer and signal processing circuits

Applications

• Custom hybrid integrated circuit assembly
• Computer logic interface protection
• Signal switching matrices

Procurement Notes

Verify the specific die attachment requirements and handling procedures with Microchip Technology prior to procurement. As a bare die component, it requires specialized surface mount equipment and cleanroom conditions for proper placement and bonding. Confirm that the selected substrate and packaging solution are compatible with the die's thermal and mechanical specifications to ensure reliable operation.

Selection Notes

Select this component when a discrete packaged diode is unsuitable due to space constraints or when integrating the diode directly into a custom ASIC or hybrid module. Ensure the design supports the necessary wire bonding or flip-chip interconnects. Verify that the system voltage does not exceed the 250 V rating under all operating conditions.

Part Context

This part belongs to Microchip Technology's portfolio of general-purpose and switching diodes. Unlike standard packaged components, the CD5196 is provided as an unpackaged die, intended for use by engineers designing custom semiconductor solutions or advanced hybrid packages where internal diode structures are required.

Replacement Considerations

No public confirmed substitute part numbers are available for direct replacement. Due to its unique bare die format, equivalent functionality must be achieved through custom design or selection of a different packaged diode if the application permits.