CD54HC173F3A

Overview

The CD54HC173F3A is a high-speed CMOS quad D-type flip-flop manufactured by Harris Corporation. It features positive edge triggering, true outputs, and three-state output control. The device operates within a supply voltage range of 2V to 6V and supports data rates up to 20 MHz. It is housed in a ceramic dual in-line package (CDIP-16) with a glass-sealed body. The component is rated for an operating temperature range from -55°C to +125°C.

Feature Summary

• Quad D-type flip-flops with positive edge triggering
• Three-state outputs with dual output enable
• Ceramic dual in-line package construction

Applications

• High-speed digital logic circuits
• Data storage and register applications
• Military and aerospace electronic systems

Procurement Notes

Verify the manufacturer origin, as Texas Instruments also lists this part number. Confirm the specific suffix 'F3A' matches the required ceramic DIP-16 package variant. Check RoHS compliance status, as the source indicates non-compliance. Ensure the supplier provides traceability documentation suitable for military or industrial specifications.

Selection Notes

Select this component when a four-bit storage element with three-state bus compatibility is required. The HC series offers standard CMOS performance. Consider the HCT variant if TTL input levels are necessary for system interfacing. Verify that the wide temperature range meets the environmental requirements of the target application.

Part Context

This component belongs to the Harris CD54HC173 series of high-speed CMOS logic devices. It is functionally similar to other quad D-type flip-flops but distinguished by its military-grade ceramic packaging. The F3A suffix typically denotes the specific lead form and package style associated with this product line.

Replacement Considerations

The CD54HCT173F3A serves as a functional substitute with compatible pinout and logic functions. Note that the HCT version utilizes TTL-compatible input thresholds rather than standard CMOS levels. Verify package dimensions and thermal characteristics before substitution.