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Product Detailed Parameters
- Description：DIODE SCHOTTKY 20V 3A DIE
- Series：-
- Mfr：Microchip Technology
- Package：Tape & Reel (TR)
- Technology：Schottky
- Voltage - DC Reverse (Vr) (Max)：20 V
- Current - Average Rectified (Io)：3A
- Voltage - Forward (Vf) (Max) @ If：550 mV @ 3 A
- Speed：Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：-
- Current - Reverse Leakage @ Vr：100 µA @ 20 V
- Capacitance @ Vr, F：-
- Mounting Type：Surface Mount
- Package / Case：Die
- Supplier Device Package：Die
- Operating Temperature - Junction：-65°C ~ 125°C
- Grade：-
- Qualification：-
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Overview
The CD5820 is a silicon dioxide passivated Schottky barrier rectifier chip manufactured by Microchip Technology. It is designed for surface-mount applications with a maximum repetitive peak reverse voltage of 20 V and an average forward current rating of 3 A. The device features a low forward voltage drop, typically 0.55 V at rated current, and a low leakage current of 0.1 mA. It is compatible with standard wire bonding and die attach techniques, excluding solder reflow processes.
Feature Summary
- Schottky barrier rectification technology for high-speed switching
- Silicon dioxide passivation for environmental stability
- Compatible with wire bonding and die attach assembly methods
Applications
- High-frequency rectification in power supply circuits
- Free-wheeling diodes in DC-DC converters
- Clamping diodes in protection circuits
Procurement Notes
Verify the specific datasheet version and compliance status directly with Microchip Technology or authorized distributors before procurement. Confirm that the application environment does not require solder reflow compatibility, as this component is explicitly incompatible with such processes. Ensure all technical specifications meet the design requirements for voltage, current, and thermal performance.
Selection Notes
Select the CD5820 when a surface-mountable Schottky diode with a 20 V reverse voltage and 3 A current capacity is required. Consider its incompatibility with solder reflow when choosing assembly methods. Evaluate the low forward voltage characteristic for efficiency gains in low-voltage applications compared to standard PN junction diodes.
Part Context
The CD5820 belongs to Microchip's discrete semiconductor portfolio, specifically within the Schottky diodes and rectifiers category. It serves as a bare die or chip component, intended for integration into custom packages or hybrid circuits rather than being sold as a standalone packaged device for direct PCB mounting without further processing.
FAQ
Is the CD5820 compatible with solder reflow assembly?
No, the CD5820 is not compatible with solder reflow processes. It is suitable for wire bonding and die attach techniques only.
What is the maximum forward voltage of the CD5820?
The maximum forward voltage is specified as 0.55 V.
