CD74HC173MT

Overview

The CD74HC173MT is a high-speed CMOS logic quad D-type flip-flop manufactured by Texas Instruments. It features three-state buffered outputs and operates within a supply voltage range of 2 V to 6 V. The device supports a propagation delay of 200 ns and provides output currents of -7.8 mA (high) and 7.8 mA (low). It is housed in a 16-lead SOIC package and functions across an extended temperature range from -55°C to +125°C.

Feature Summary

• Three-state buffered outputs for bus-driven applications
• Gated input and output enables for controlled data flow
• High-speed CMOS technology with low power consumption

Applications

• Register storage in digital systems
• Shift register configurations
• Bus-oriented memory circuits

Procurement Notes

Verify the specific suffix 'MT' corresponds to the 16-lead SOIC package variant when sourcing. Confirm that the operating voltage and temperature ranges align with system requirements, as the HC series supports a wide supply range. Ensure proper IC handling procedures are followed during assembly to prevent electrostatic discharge damage to the CMOS inputs.

Selection Notes

Select this component for designs requiring four independent D-type flip-flops with tri-state outputs in a compact surface-mount package. It is suitable for applications needing gated control over both data entry and output states. Consider the 200 ns propagation delay and 7.8 mA drive capability when designing timing-critical or load-heavy sections of the circuit.

Part Context

This part belongs to the CD74HC173 family of high-speed CMOS logic devices. It is functionally compatible with other 74HC series components, offering standard fanout capabilities. The device integrates four D-type flip-flops with positive-edge triggering into a single integrated circuit, providing a cost-effective solution for multi-bit storage needs.

Replacement Considerations

The CD74HC173PWR serves as a pin-compatible alternative in a TSSOP-16 package. Other variants such as CD74HC173M96 may offer different packaging options. Verify electrical specifications and package dimensions before substitution to ensure mechanical fit and functional equivalence.