CD74HCT125MT

Overview

The CD74HCT125MT is a high-speed CMOS logic quad buffer with three-state outputs manufactured by Texas Instruments. It operates within a supply voltage range of 4.5 V to 5.5 V and supports an extended industrial temperature range from -55°C to +125°C. The device features a 14-pin Small Outline Integrated Circuit (SOIC) package, specifically SOP14 with a .25-inch width. It functions as a unidirectional bus driver with low-enable control logic.

Feature Summary

• Provides four independent non-inverting buffer channels for signal transmission
• Features three-state outputs allowing multiple drivers to share a common bus line
• Utilizes high-speed CMOS technology for efficient power consumption and fast switching
• Operates reliably across a wide industrial temperature spectrum

Applications

• Bus-oriented memory and address drivers
• Clock distribution buffers
• Bidirectional data bus transceivers

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to confirm package type and environmental compliance. Ensure the component matches the required HCT logic family specifications for your system design. Cross-reference the part number with official Texas Instruments documentation to validate availability and manufacturing status before procurement.

Selection Notes

Select this component when designing systems requiring buffered signals with tri-state capability on a shared bus architecture. It is suitable for applications demanding operation over a wide temperature range. Ensure the load capacitance requirements are met, as the device specifies a maximum load capacitance of 50 pF for optimal performance.

Part Context

This component belongs to the CD74HCT series of high-speed CMOS logic devices produced by Texas Instruments. It is functionally compatible with other quadruple bus buffers in the 74HCT family, such as the SN74HCT125, though pinouts and specific electrical characteristics should be verified. The MT suffix indicates the surface-mount SOIC packaging variant.