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The CDBB1150-HF is a Schottky barrier rectifier manufactured by Comchip Technology, housed in the DO-214AA (SMB) surface-mount package. It features a maximum repetitive reverse voltage of 150 V and an average forward current rating of 1 A. The device exhibits a typical forward voltage drop of 900 mV at rated current and supports a high surge current capability of 50 A. Operating temperatures range from -55 °C to +150 °C junction temperature, with a low reverse leakage current of 50 µA.
Verify the specific ordering suffix and environmental compliance status directly with the manufacturer or authorized distributors before procurement. Confirm that the component meets all required automotive or industrial qualification standards if applicable to your design. Ensure the selected packaging format matches your automated assembly equipment specifications. Cross-reference the datasheet revision date to guarantee access to the most current electrical parameters and mechanical drawings.
Select this component when a surface-mount Schottky rectifier with SMB footprint is required for 150 V applications. Consider the thermal resistance and package size constraints relative to standard SOD-123 devices. Evaluate the forward voltage drop against system efficiency targets. Verify that the peak repetitive reverse voltage exceeds the maximum circuit voltage with adequate safety margin. Assess the surge current rating against potential inrush conditions in the target application.
This part belongs to Comchip Technology's CDBB series of Schottky barrier rectifiers designed for surface-mount technology. The series emphasizes high reliability and low profile construction compared to traditional axial leaded packages. These components are engineered for modern electronics manufacturing processes requiring compact footprints and high thermal performance.
Direct replacements must match the 150 V reverse voltage, 1 A forward current, and DO-214AA (SMB) package dimensions. Verify compatibility of forward voltage and reverse leakage specifications to ensure equivalent circuit performance. Check pinout alignment and thermal dissipation capabilities before substituting.