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The CDBFR0230 is a surface-mount Schottky barrier diode manufactured by Comchip Technology. It features a single silicon junction with a maximum repetitive peak reverse voltage of 35 V and an average forward current rating of 0.2 A. The device utilizes a plastic epoxy chip carrier package (R-PBCC-N2) designed for automated surface mounting. It supports operation up to a maximum junction temperature of 125 °C and withstands peak reflow temperatures of 260 °C, ensuring compatibility with standard SMT assembly processes.
Verify the specific suffix against official documentation, as variations such as -HF indicate halogen-free compliance. Confirm the exact package designation matches the required footprint, as datasheets may reference R-PBCC-N2 or similar identifiers. Ensure RoHS certification status aligns with project requirements before finalizing procurement orders.
Select this component for applications requiring low forward voltage drop and high-speed rectification in compact designs. The 35 V reverse voltage rating suits low-voltage DC systems. Evaluate thermal management capabilities given the 125 °C junction limit and ensure the PCB layout accommodates the specific chip carrier dimensions for reliable soldering.
This part belongs to Comchip Technology's Schottky diode portfolio, which includes various packages like SOD-323F and SOT-23 variants. The CDBFR series specifically targets space-constrained surface mount applications. Related models include CDBFR0240 and CDBURT0230L-HF, offering different voltage ratings or profile heights within the same product family.
Publicly confirmed substitute part numbers are not available in the provided source material.