CDC208NSRG4

Overview

The CDC208NSRG4 is a dual fanout buffer manufactured by Texas Instruments, designed for clock distribution applications. It features two independent circuits, each providing a 1:4 input-to-output ratio. The device accepts TTL inputs and generates CMOS outputs, supporting a maximum operating frequency of 60 MHz. It operates within a supply voltage range of 4.5 V to 5.5 V and is rated for an extended industrial temperature range from -40°C to +85°C. The component is housed in a 20-SOIC surface-mount package with a width of 5.30 mm.

Feature Summary

• Dual circuit configuration with 1:4 fanout ratio per channel
• TTL input compatibility with CMOS output levels
• Maximum operating frequency of 60 MHz
• Extended industrial temperature range (-40°C to +85°C)

Applications

• Clock signal distribution in digital systems
• Fanout buffering for timing circuits
• Industrial control system clock management

Procurement Notes

Verify the specific ordering suffix NSRG4 against the manufacturer's official datasheet to confirm package type, tape-and-reel specifications, and environmental compliance details. Ensure the selected variant matches the required 20-SOIC footprint and voltage parameters for the target design.

Selection Notes

Select this component when a dual-channel clock buffer with TTL input and CMOS output is required. Confirm that the 60 MHz frequency limit and 4.5 V to 5.5 V supply voltage align with the system requirements. Verify that the 20-SOIC package dimensions fit the PCB layout constraints.

Part Context

This part belongs to the broader category of clock buffers and drivers. It serves as a specific solution for distributing clock signals with defined logic level translation from TTL to CMOS. The dual-channel architecture allows for efficient management of multiple clock domains within a single package.

Replacement Considerations

Consult the manufacturer's cross-reference tools or official substitution guides to identify compatible alternatives. Verify pin compatibility, electrical characteristics, and package dimensions before replacing the component in an existing design.