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The CENGPXA270-312-10-550EC is a System-on-Module (SoM) manufactured by Beacon EmbeddedWorks. It integrates an Intel XScale PXA270 processor core operating at 550 MHz. The module provides embedded electronics capabilities designed for industrial and communication applications. It features compact form factors to facilitate integration into custom carrier boards, supporting accelerated time-to-market for innovative electronic designs through pre-certified hardware solutions.
Verify the specific revision level of the PXA270 processor core to ensure compatibility with target software environments. Confirm that the integrated memory configuration matches the application requirements for code storage and runtime data handling. Ensure the carrier board design adheres to the electrical specifications provided in the official technical documentation to maintain signal integrity and power stability.
Select this module when a proven, compact SoM solution based on the PXA270 architecture is required for legacy or specific embedded constraints. Evaluate the trade-off between the established ecosystem of the XScale platform and newer processor alternatives. Consider the availability of development tools and support resources from Beacon EmbeddedWorks for the specific product line during the selection process.
Beacon EmbeddedWorks specializes in creating award-winning System-on-Modules and embedded electronics products. As part of the discoverIE Group plc, the company leverages extensive history in developing proprietary hardware solutions. This product line focuses on delivering powerful, secure, and customizable modules that help customers exceed expectations and accelerate their product development cycles effectively.
The module utilizes the Intel XScale PXA270 processor core.
Yes, the product profile indicates suitability for industrial and communication applications.