CENGPXA270-416-10-550HIR

CENGPXA270-416-10-550HIR

  • Description:IC MOD PXA270 416MHZ 64MB
  • Series:-

SKU:fbd8d9e6ab81 Category: Brand:

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Product Detailed Parameters

  • Description:IC MOD PXA270 416MHZ 64MB
  • Series:-
  • Mfr:Beacon EmbeddedWorks
  • Package:Bulk
  • Module/Board Type:MCU Core
  • Core Processor:PXA270
  • Co-Processor:-
  • Speed:416MHz
  • Flash Size:64MB
  • RAM Size:64MB
  • Connector Type:SO-DIMM-144
  • Size / Dimension:2.370" L x 2.670" W (60.20mm x 67.80mm)
  • Operating Temperature:-40°C ~ 85°C

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CENGPXA270-416-10-550HIR

Overview

The CENGPXA270-416-10-550HIR is a System-on-Module (SoM) manufactured by Beacon EmbeddedWorks, integrating an Intel XScale PXA270 processor core. This module operates at a clock speed of 416 MHz and includes 64 MB of RAM. It utilizes the SO-DIMM form factor for connectivity, designed to facilitate rapid integration into embedded systems. The component serves as a complete computing solution, combining processing power with memory resources on a single compact board.

Feature Summary

  • Integrates Intel XScale PXA270 processor architecture for efficient embedded computing
  • Provides integrated 64 MB RAM configuration within a compact module design
  • Utilizes standard SO-DIMM interface for simplified system integration

Applications

  • Wireless networking equipment
  • Human Machine Interface (HMI) displays
  • Motor control applications

Procurement Notes

Verify the specific ordering suffix against official Beacon EmbeddedWorks documentation to confirm exact frequency, temperature range, and RoHS compliance status. Ensure compatibility with host carrier board pinouts before procurement. Cross-reference part numbers with authorized distributors to avoid counterfeit components. Confirm current product availability status as legacy modules may have limited supply chains.

Selection Notes

Select this module when a proven XScale architecture is required for legacy software compatibility or specific peripheral support. Evaluate the 416 MHz performance envelope against application latency requirements. Consider the SO-DIMM footprint constraints relative to the target enclosure. Assess development toolchain availability for the PXA270 core prior to final selection.

Part Context

This module belongs to the CENG family of System-on-Modules from Beacon EmbeddedWorks, which are based on Logic PD's historical embedded designs. These modules are engineered to accelerate time-to-market by providing pre-certified and verified computing solutions. The PXA270-based variants are typically utilized in industrial and communication sectors requiring reliable, compact processing capabilities.

Replacement Considerations

Consult official Beacon EmbeddedWorks documentation for direct cross-references. Variants such as CENGPXA270-520-10-504HCR offer different clock speeds but maintain similar architectural features. Verify mechanical and electrical compatibility before substituting with other SoM series.

CENGPXA270-416-10-550HIRCENGPXA270-416-10-550HIR

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