CH87062M1P0-R0

Headers, Male Pins Overview

The CH87062M1P0-R0 is a male pin header connector manufactured by Cvilux USA. It features a surface mount design with six positions arranged in a single row. The connector utilizes a 2.54 mm (0.100 inch) pitch for standard spacing between pins. This component is designed for reliable electrical interconnection in electronic assemblies requiring board-level mounting.

Headers, Male Pins Feature Summary

• Surface mount configuration for automated PCB assembly
• Single row male pin architecture
• Standard 2.54 mm contact spacing

Headers, Male Pins Applications

• Consumer electronics internal connections
• General purpose circuit board interconnects
• Wire harness termination points

Headers, Male Pins Procurement Notes

Verify the specific package variant and pin configuration against the official Cvilux datasheet before procurement. Ensure compatibility with existing PCB footprint dimensions and soldering profiles. Confirm that the surface mount orientation matches the assembly requirements to prevent installation errors during production.

Headers, Male Pins Selection Notes

Select this component when a low-profile, surface-mounted header is required for fixed interconnections. The 2.54 mm pitch ensures compatibility with standard ribbon cables and wire harnesses. Consider the mechanical stability of the surface mount design versus through-hole alternatives based on vibration requirements.

Headers, Male Pins Part Context

This part belongs to the CH87 series of headers produced by Cvilux. The manufacturer specializes in connectors, FFC cables, and wire harnesses primarily for consumer electronics. The CH87 series provides standardized solutions for board-to-board or board-to-wire connections within compact electronic devices.

Headers, Male Pins Replacement Considerations

Cross-reference with other 6-position, 2.54 mm pitch surface mount headers from manufacturers such as Samtec or Molex if availability is an issue. Verify that substitute parts match the exact height, contact plating, and retention mechanism specifications.