CI2203P1VK0-NH

Headers, Male Pins Overview

The CI2203P1VK0-NH is a wire-to-board connector header manufactured by Cvilux USA. It features a 3-position configuration with a 2.50mm (0.098 inch) pitch. The component utilizes through-hole termination for secure PCB mounting. The housing is designed for single-row male pin applications, providing reliable electrical interconnection in consumer electronics assemblies.

Headers, Male Pins Feature Summary

• Through-hole mounting style for stable board integration
• Single-row male pin configuration for wire-to-board connections
• 2.50mm pitch spacing for standardized circuit layout

Headers, Male Pins Applications

• Consumer electronics internal wiring
• General-purpose PCB interconnects
• Wire harness assembly systems

Headers, Male Pins Procurement Notes

Verify the exact part number CI2203P1VK0-NH against manufacturer datasheets to confirm the 2.50mm pitch and 3-position count. Ensure compatibility with mating wire terminals and PCB hole dimensions. Check RoHS compliance status if required by specific project regulations before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a 2.50mm pitch through-hole header is required for three-wire connections. Confirm that the single-row male pin design matches the mating socket or wire harness specifications. Evaluate mechanical stability needs as through-hole offers higher retention than surface mount alternatives.

Headers, Male Pins Part Context

This part belongs to the Cvilux USA connector portfolio, which specializes in interconnect solutions for consumer electronics. The CI2203P1VK0-NH represents a standard wire-to-board header option within their broader catalog of FFC cables and wire harnesses, targeting general electronic assembly markets.

Headers, Male Pins Replacement Considerations

Cross-reference with other 3-position, 2.50mm pitch through-hole headers from different manufacturers if supply constraints exist. Verify identical mechanical dimensions and contact plating specifications to ensure functional interchangeability without redesigning the PCB footprint.