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CI2504P1H00-LF is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Cvilux USA. Its product description is 4 POS 2.50MM (.098) WIRE TO BOAR. Review the specifications below when checking this part for your BOM.
The CI2504P1H00-LF is a 4-position wire-to-board connector header from the Cvilux USA CI25 series. It features a 2.50mm (0.098 inch) pitch and utilizes through-hole, right-angle mounting for secure PCB attachment. The connector employs male pins with circular contact shapes and pin-lock fastening. Rated for 3A current and 50VAC voltage, it operates within a temperature range of -25°C to 85°C. The housing is made of halogen-free PA6T reinforced with glass fiber, rated UL94 V-0. Contacts are brass with tin plating, providing a thickness of 120.0µin (3.05µm).
Verify that the specific part number suffix matches project requirements, as variations may exist between LF and NH designations. Confirm RoHS3 compliance status directly with the manufacturer documentation before finalizing procurement decisions. Ensure the selected variant aligns with the intended environmental and regulatory standards for the target application.
Select this component when a low-profile, right-angle connection is required for space-constrained designs. The 2.50mm pitch offers a balance between density and ease of assembly. Consider the through-hole mounting method for applications requiring robust mechanical stability compared to surface-mount alternatives.
This component belongs to the CI25 series of wire-to-board connectors manufactured by Cvilux USA. The series is designed primarily for consumer electronics applications, offering a range of positions and configurations. The CI25 series emphasizes compactness and reliability, utilizing high-performance thermoplastic materials for the housing and durable metal alloys for the contacts.
The CI2504P1H00-NH is a documented alternative within the same series. Verify if the non-halogen designation or other minor specification differences impact the specific application requirements before substituting.
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