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CIH03Q3N3SNC is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Samsung Electro-Mechanics. Its product description is FIXED IND 3.3NH 270MA 300MOHM SM. Review the specifications below when checking this part for your BOM.
The CIH03Q3N3SNC is a fixed surface-mount inductor from Samsung Electro-Mechanics, designed for high-frequency applications. It features an inductance of 3.3 nH with a tolerance of ±0.3 nH and operates at a test frequency of 100 MHz. The component has a maximum DC resistance (DCR) of 300 milliohms and supports a rated current of 270 mA. Housed in a compact 0201 (0603 metric) package measuring 0.60mm x 0.30mm, it offers a self-resonant frequency of 6.7 GHz and a Q value of 5 at 100 MHz. The device is unshielded, utilizes multilayer ceramic technology, and functions within a temperature range of -55°C to 125°C.
Verify the specific suffix 'Q' against official Samsung Electro-Mechanics documentation to confirm material or reliability specifications distinct from standard variants. Confirm availability status as inventory levels fluctuate. Ensure compatibility with automated pick-and-place equipment due to the small 0201 package dimensions. Validate that the 270 mA current rating meets circuit requirements under all operating conditions.
Select this component when ultra-low inductance values are required for VHF/UHF bands. The 0201 size provides space efficiency compared to larger packages. Consider the 300 mΩ DCR impact on power loss if used in power-sensitive paths. The unshielded design may require careful layout to minimize electromagnetic interference coupling with adjacent traces.
This part belongs to the CIH series of chip inductors manufactured by Samsung Electro-Mechanics. The series focuses on providing stable inductance values for high-frequency wireless communication devices. The manufacturer specializes in passive components for mobile and automotive electronics, leveraging multilayer ceramic technologies for precision and reliability in compact form factors.
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