CLI-1375B-83T

Overview

The CLI-1375B-83T is a piezoelectric buzzer from the Same Sky CLI series, designed for PCB mounting. It operates at a nominal voltage of 3V DC and produces a sound pressure level of 83 dB at a distance of 10 cm. The device features a resonant frequency of 2.7 kHz and draws a current of 30 mA during operation. Its physical dimensions are 12.5 mm in length, 9.5 mm in width, and 4.6 mm in height.

Feature Summary

• Utilizes piezoelectric technology to generate acoustic signals without requiring an internal oscillator circuit.
• Designed for direct surface-mount placement on printed circuit boards using standard SMD footprint.
• Constructed with a molded case that provides environmental protection for the internal components.

Applications

• Consumer electronics such as handheld devices and remote controls
• Home appliances including microwaves and washing machines
• Industrial control panels and instrumentation

Procurement Notes

Verify the specific suffix codes against official datasheets to confirm acoustic performance and electrical characteristics. Ensure the ordering quantity aligns with manufacturer minimums and lead times. Confirm compliance with RoHS directives and material declarations prior to procurement.

Selection Notes

Select this component based on the required 83 dB sound pressure level and 2.7 kHz resonant frequency. Evaluate the 3V DC operating voltage against the system power supply. Consider the 12.5 x 9.5 mm footprint for PCB layout constraints and thermal management requirements.

Part Context

This buzzer belongs to the CLI series of surface-mount piezoelectric devices manufactured by Same Sky. The series offers various acoustic outputs and form factors suitable for compact electronic designs. It serves as a replacement for through-hole or larger surface-mount buzzers in space-constrained applications.

Replacement Considerations

Check for cross-references within the Same Sky CLI family for alternative sound levels or voltages. Verify mechanical compatibility with existing PCB footprints before substituting with similar components from other manufacturers.