CLM2D-GEC-CYBA0893

Overview

The CLM2D-GEC-CYBA0893 is a single-color green surface-mount LED from the LM2-D series by Cree LED. It features a 2832 SMD package with dimensions of 3.2mm x 2.8mm and utilizes a 4-PLCC configuration. The device emits light at a dominant wavelength of 527nm to 528nm, offering high luminous intensity ranging from 3550 to 7100 mcd. It operates within a temperature range of -40°C to +100°C and includes options for 70° or 90° beam angles via Horizon technology.

Feature Summary

• Utilizes Flip-Chip architecture for enhanced thermal management
• Offers specific beam angle configurations for targeted illumination
• Provides high luminous intensity in a compact standard package

Applications

• Bright sunlight readable indicators
• Low-power consumption outdoor applications
• Indoor lighting systems
• Vertical horticulture setups

Procurement Notes

Verify the exact datasheet specifications directly from the manufacturer before integration. Confirm that the 4-PLCC package and 2832 footprint match your PCB design requirements. Ensure the operating temperature range aligns with your environmental conditions. Cross-reference the dominant wavelength to guarantee color consistency with system standards.

Selection Notes

Select this component when high brightness is required for visibility in challenging lighting conditions. The choice between 70° and 90° beam angles should depend on whether the application requires broad dispersion or focused vertical illumination. Consider the thermal resistance benefits of the Flip-Chip design for long-term reliability in continuous operation scenarios.

Part Context

This part belongs to the LM2-D Standard Color SMD LED series, designed for general indication and display applications. The series is characterized by its small form factor and robust performance metrics suitable for modern electronic devices requiring efficient light sources.

Replacement Considerations

Consult official substitution guides for compatible alternatives within the same series. Verify pinout compatibility and thermal characteristics when considering cross-model replacements.