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The SN74LVC574A-Q1 is an automotive-grade, octal edge-triggered D-type flip-flop featuring three-state outputs. It operates within a supply voltage range of 1.65 V to 3.6 V and supports both CMOS and TTL input logic levels. The device exhibits a maximum propagation delay of 8 ns and delivers high drive capability with output currents of ±24 mA. Designed for reliability in harsh environments, it functions across an extended temperature range from -40°C to +125°C. Packaged in a 20-pin TSSOP format, this component integrates eight independent D-type flip-flops into a single circuit element.
Verify the complete ordering suffix matches CLVC574AQPWRG4Q1 to ensure correct packaging and automotive qualification. Confirm the manufacturer is Texas Instruments. Check RoHS compliance status. Validate the package type is TSSOP-20. Ensure the temperature rating covers -40°C to +125°C. Cross-reference the datasheet revision date. Inspect for physical damage upon receipt.
Select this component when designing automotive logic circuits requiring high speed and wide voltage tolerance. The 8 ns propagation delay suits high-frequency applications. The ±24 mA output current drives heavy loads effectively. The three-state feature allows multiple devices on shared buses. Consider the TSSOP-20 package for surface-mount assembly constraints. Verify compatibility with system voltage levels between 1.65 V and 3.6 V.
This part belongs to the SN74LVC574A family of octal D-type flip-flops. The 'Q1' suffix denotes automotive qualification under AEC-Q100 standards. The 'PW' indicates a 20-pin Thin Shrink Small Outline Package. The 'G4' suffix typically refers to specific tape-and-reel packaging configurations. This series provides robust performance for digital logic operations in critical automotive environments.
Direct substitutes include SN74LVC574APW for non-automotive use. For automotive needs, verify equivalent AEC-Q100 qualified parts. Check pinout compatibility before swapping. Ensure voltage and current ratings match or exceed original requirements. Confirm package dimensions align with existing PCB footprints.