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The CM1412-03CP is a dual-channel EMI filter array with integrated ESD protection, designed for headset and microphone ports. It utilizes an RC Pi-filter topology (C-R-C) to attenuate electromagnetic interference while passing audio signals. Key electrical parameters include a resistance of 68 Ohms per channel, capacitance values supporting low-pass filtering, and a cutoff frequency characteristic. The device offers greater than 35dB attenuation in the 800-2700 MHz range and provides +8kV IEC contact discharge ESD protection. It operates within a temperature range of -40°C to +85°C and is housed in a compact 5-bump Chip Scale Package (CSP) measuring approximately 0.93mm by 1.41mm.
Verify current availability status as this component may be subject to limited supply or end-of-life conditions. Confirm package orientation and pinout compatibility during integration. Ensure design reviews account for the specific CSP footprint dimensions and thermal characteristics. Cross-reference datasheet revisions to confirm parameter consistency before finalizing procurement orders.
Select this component for applications requiring simultaneous EMI suppression and ESD protection in space-constrained mobile devices. The dual-channel configuration supports independent microphone and headset lines. Consider the 68 Ohm series resistance impact on audio impedance matching. Verify that the 5-bump CSP footprint aligns with PCB layout capabilities and soldering profiles.
This part belongs to the CM1410/CM1412 family of EMI filter arrays from onsemi. It is functionally and pin-compatible with similar legacy parts like the CMD CSPEMI202A. The CM1412 specifically targets 2-channel audio interfaces, distinguishing it from higher-channel variants like the CM1410 which offers four channels. It represents a specialized solution for consumer electronics audio ports.
The CM1412 is noted as functionally and pin compatible with the CMD CSPEMI202A. Designers should verify mechanical fit and electrical parameter equivalence when substituting. Check for any updates in ESD performance ratings or packaging materials between original and replacement sources.