CM6400A

Overview

The CM6400A is a 24-bump EMI filter with integrated ESD protection designed for data line applications. It functions as a third-order low-pass LC (Pi) filter featuring ten channels. The component utilizes a WLCSP package and incorporates specific passive values, including an inductance of 35nH and capacitance of 15pF per channel.

Feature Summary

• Integrates electromagnetic interference filtering with electrostatic discharge protection in a single device
• Provides multi-channel signal conditioning suitable for high-density data interfaces
• Utilizes wafer-level chip-scale packaging to minimize footprint

Applications

• Data line protection in computing systems
• High-speed interface filtering in consumer electronics
• Signal integrity management in portable devices

Procurement Notes

Verify the exact package type and pin configuration against the official onsemi datasheet before integration. Confirm that the 24-bump WLCSP form factor aligns with your PCB layout constraints. Ensure compatibility with your assembly processes for wafer-level chip-scale packages. Cross-reference the specific revision level to guarantee functional consistency with design specifications.

Selection Notes

Select this component when simultaneous EMI suppression and ESD protection are required for multiple data lines within space-constrained environments. The integrated LC topology reduces the need for discrete components. Evaluate the 35nH inductance and 15pF capacitance values against target frequency attenuation requirements. Consider the 24-bump package density for high-pin-count interface solutions.

Part Context

This part belongs to onsemi's portfolio of EMI filters with ESD protection. It is specifically engineered for data line applications where signal integrity and component protection are critical. The device consolidates filtering and protection functions to simplify circuit design and reduce overall system complexity.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with alternative components by comparing electrical parameters and package dimensions against the original specification sheet.