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CMD255C3 is listed in the RF Mixers range at ChipApex. The manufacturer field lists Qorvo. Its product description is 16 - 26 GHZ MIXER. Review the specifications below when checking this part for your BOM.
The CMD255C3 is a general-purpose double-balanced mixer designed for up-conversion and down-conversion applications. It operates within a radio frequency range of 16 GHz to 26 GHz, with an intermediate frequency (IF) bandwidth extending from 0 Hz to 9 GHz. The device features a maximum conversion loss of 10 dB and utilizes a leadless surface mount package, specifically a 12-QFN (2.9x2.9 mm) footprint. This component supports LO frequencies matching the RF band and is suitable for high-performance fundamental mixing tasks in microwave systems.
Verify the specific datasheet version and mechanical drawing dimensions prior to procurement. Confirm that the 12-QFN package outline matches the target PCB land pattern exactly. Ensure thermal management requirements are addressed during layout, as power dissipation characteristics must be validated against the application environment. Cross-reference the manufacturer's latest revision notes for any pinout or electrical parameter updates.
Select this component when operating frequencies fall strictly within the 16-26 GHz range. Evaluate the 10 dB conversion loss specification against system link budget requirements. Consider the IF bandwidth limit of 9 GHz for baseband or intermediate frequency handling. The leadless package requires specialized assembly techniques; verify manufacturing capabilities before selection.
This part belongs to Qorvo's portfolio of RF mixers, often associated with Custom MMIC Design technology. It serves as a fundamental building block for high-frequency signal translation. The CMD255C3-EVB evaluation board is available for performance verification. It complements other microwave components like amplifiers in complete RF front-end designs.
No public confirmed substitute part numbers are documented. Direct replacement requires careful re-evaluation of impedance matching and thermal constraints due to the unique leadless package geometry.
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