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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CMX469AD3 is a telecommunications interface integrated circuit manufactured by CML Microcircuits, functioning as a modulator and demodulator. It supports FFSK and MSK modulation schemes at data rates of 1200, 2400, and 4800 bps. The device operates on a supply voltage ranging from 2.7 V to 5.5 V with a typical operating current of 4.5 mA. It is housed in a SOIC-20 surface-mount package and is rated for an industrial temperature range of -40°C to +85°C. The maximum power dissipation is specified at 560 mW.
Verify the specific suffix AD3 against the manufacturer's datasheet to confirm pinout compatibility and functional specifications. Ensure that the SOIC-20 footprint matches the design requirements. Check for moisture sensitivity level (MSL) ratings if reflow soldering is required. Confirm RoHS compliance status through official documentation before finalizing procurement.
Select the CMX469AD3 when FFSK or MSK modulation is required for low-speed data transmission. Compare the SOIC-20 package dimensions against available board space. Evaluate the 4.5 mA current consumption against system power budgets. Consider the -40°C to +85°C operating range for environmental suitability.
This component belongs to the CMX469 series of telecom interface ICs. It shares core modulation capabilities with variants like the CMX469AE2, which utilizes a TSSOP-24 package. The AD3 suffix specifically denotes the SOIC-20 packaging option within this product family.