CNU113-314-2301-VE

$12.79

Description：314P, Automotive Grade MXM3.1 Ty
Series：*
Mfr：Yamaichi Electronics
Package：Tape & Reel (TR)

SKU:dd10154757ff Category: Edgeboard Connectors Brand: Yamaichi Electronics

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Product introduction

Product Detailed Parameters

Description：314P, Automotive Grade MXM3.1 Ty
Series：*
Mfr：Yamaichi Electronics
Package：Tape & Reel (TR)
Card Type：-
Gender：-
Number of Positions/Bay/Row：-
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Mounting Type：-
Termination：-
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CNU113-314-2301-VE

Overview

The CNU113-314-2301-VE is a standard card edge connector manufactured by Yamaichi Electronics. It features 314 positions with a 0.50mm pitch, designed for right-angle surface mount technology (SMT) installation. The component supports SMARC and MXM3.1 form factors and includes an integrated screw-nut mounting system for secure attachment. Rated for industrial applications, it provides reliable electrical interconnection between the board and mating edge card.

Feature Summary

Supports SMARC and MXM3.1 module standards
Integrates screw-nut mounting mechanism for stability
Right-angle SMT design for compact assembly

Applications

SMARC module interconnects
MXM3.1 graphics or compute modules
Industrial embedded systems requiring high-density connections

Procurement Notes

Verify the complete part number including the -VE suffix to ensure correct mechanical specifications. Confirm that the target PCB layout accommodates the right-angle SMT footprint and the required clearance for the integrated screw-nut hardware. Check RoHS compliance status in the official datasheet before finalizing procurement.

Selection Notes

Select this connector when a high-pin-count interface is required for SMARC or MXM3.1 compliant modules. The 0.50mm pitch allows for dense signal routing in limited space. Ensure the design utilizes the right-angle orientation to optimize vertical profile and board real estate usage effectively.

Part Context

This component belongs to the Yamaichi Electronics standard card edge connector family. It serves as a critical interface solution for modular computing architectures. The series is engineered for robust performance in demanding environments, providing stable connectivity for high-speed data and power transmission in modern electronic devices.