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CNY17-4-000E is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is OPTOISO 5KV TRANS W/BASE 6-DIP. Review the specifications below when checking this part for your BOM.
The CNY17-4-000E is a single-channel transistor output optocoupler manufactured by Broadcom Limited. It features an NPN phototransistor output and operates with a maximum collector-emitter voltage of 70 V and a peak forward current of 60 mA. The device provides high isolation capability with a rated insulation voltage of 5000 Vrms. Electrical performance includes a minimum current transfer ratio of 40% at an input current of 10 mA and collector-emitter voltage of 5 V. Typical response times are specified at 5 µs for both rise and fall periods under standard test conditions.
Verify the specific suffix designation during procurement to ensure correct packaging configuration. The base model CNY17-4-000E typically utilizes tube packaging, whereas variants such as 300E indicate bent-lead SMD options and 500E denotes tape-and-reel formats. Confirm that the received components match the required mounting style and reel specifications for automated assembly processes. Cross-reference the manufacturer part number against official Broadcom documentation to avoid confusion with similar series members.
Select this component when high isolation voltage and compact DIP-6 packaging are required for DC input applications. The device is suitable for designs needing moderate speed performance with typical 5 µs response times. Ensure the application circuit can accommodate the specified 1.7 V forward voltage drop and 60 mA maximum input current limits. Consider thermal dissipation requirements given the 250 mW power rating and verify that the 70 V collector-emitter voltage exceeds the maximum load voltage in the target circuit.
The CNY17-4-000E belongs to the CNY17 series of transistor output optocouplers produced by Broadcom Limited. This family is widely recognized for its reliability in industrial and consumer electronics applications. The product line offers various packaging options to support both through-hole and surface-mount technologies. Broadcom continues to maintain this component as a standard solution for galvanic isolation needs across diverse electronic systems.
Direct substitutes within the same series include CNY17-4-W00E for standard through-hole DIP-6 configurations. For surface-mount requirements, consider CNY17-4-300E which features bent leads for SMD assembly. Alternative packaging options include CNY17-4-500E for tape-and-reel processing. Verify pinout compatibility and electrical parameters before substituting with other manufacturers' equivalent devices.
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