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CNY171SM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is OPTOISO 4.17KV TRANS W/BASE 6SMD. Review the specifications below when checking this part for your BOM.
The CNY171SM is a single-channel transistor output optocoupler manufactured by Fairchild Semiconductor. It integrates a Gallium Arsenide infrared emitting diode with an NPN phototransistor in a surface mount DIP-6 package. Key electrical parameters include a minimum collector-emitter breakdown voltage (BVceo) of 70 V, a maximum forward current of 60 mA, and a nominal current transfer ratio of 40%. The device supports an operating temperature range from -55°C to 100°C and features a maximum dark current of 50 nA.
Verify the specific manufacturer source, as Fairchild Semiconductor has been acquired by onsemi. Confirm that the component meets RoHS compliance standards and check for UL or VDE recognition certifications required for the target application's safety regulations. Ensure the surface mount package type matches the PCB design specifications.
Select this component when a single-channel isolation solution with a 70V phototransistor output is required. The surface mount packaging facilitates automated assembly processes. Consider the 40% nominal current transfer ratio for drive circuit design and verify thermal management requirements within the specified operating temperature range.
The CNY171SM belongs to the CNY17 series of phototransistor optocouplers. This family typically includes variants such as CNY17-2 and CNY17-3, which share similar internal structures but may differ in pinout configurations or specific performance groupings. The series is designed for general-purpose isolation tasks in electronic circuits.
Compatible substitutes within the same series include CNY17-2SM and CNY17-3SM. Verify pin compatibility and current transfer ratio groups before substitution. Cross-reference with onsemi datasheets for updated manufacturing information following the acquisition.
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