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COM20019IP is listed in the Controllers range at ChipApex. The manufacturer field lists SMSC. Its product description is ARCNET CONTROLLER WITH. Review the specifications below when checking this part for your BOM.
The COM20019IP is a serial I/O controller manufactured by SMSC, designed for embedded processor and microcontroller applications. It utilizes CMOS technology and is housed in a CDIP20 ceramic dual in-line package with through-hole terminals spaced at 2.54 mm. The device operates on a nominal 5 V power supply and is rated for commercial temperature ranges, functioning between -40 °C and 70 °C. It contains 20 terminals and is not surface mountable. The component is identified as non-RoHS compliant and lacks formal qualification status.
Verify RoHS compliance requirements prior to procurement, as the COM20019IP is explicitly listed as non-compliant. Confirm that the commercial temperature range meets operational needs. Ensure the through-hole CDIP20 package fits the target PCB layout. Check for lead-based soldering constraints due to the tin/lead terminal finish.
Select this component when a hermetically sealed serial I/O controller is required for legacy or high-reliability embedded designs. The CDIP20 package suits manual assembly or wave soldering processes. Consider the 5 V logic level and commercial temperature limits against system specifications. Verify availability of compatible socket bases if field replacement is anticipated.
This part belongs to the Serial I/O Controller category within the broader embedded processor and controller segment. Manufactured by SMSC, it serves as a dedicated interface solution for microcontrollers requiring additional serial ports. The CDIP20 form factor distinguishes it from modern surface-mount alternatives, targeting applications where package durability and pin accessibility are prioritized over miniaturization.
Direct pin-compatible replacements should be sought within the SMSC serial I/O controller lineage. Verify electrical parameters such as voltage tolerance and current drive capabilities before substituting. Ensure the alternative maintains the same DIP20 footprint and hermetic sealing characteristics if environmental resistance is critical.
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