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Product Detailed Parameters
- Description：UART UNIVERSAL ASYNCHRONOUS RECE
- Series：*
- Mfr：SMSC
- Package：Bulk
- Features：-
- Number of Channels：-
- FIFO's：-
- Protocol：-
- Data Rate (Max)：-
- Voltage - Supply：-
- With Auto Flow Control：-
- With IrDA Encoder/Decoder：-
- With False Start Bit Detection：-
- With Modem Control：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The COM2017BIP is a Micro Peripheral IC manufactured by SMSC, designed for embedded processor and controller applications. It utilizes MOS technology and is housed in a CDIP14 package with a dual inline form factor. The device features 14 through-hole terminals with a pitch of 2.54 mm. It operates within a commercial temperature range, supporting a minimum working temperature and a maximum operating temperature of 70 °C. The component is not RoHS compliant and carries a tin/lead (Sn/Pb) terminal finish. Its certification status is listed as Not Qualified.
Feature Summary
- Integrated micro peripheral functionality for embedded systems
- MOS technology implementation
- Ceramic DIP packaging
Applications
- Embedded processor interfaces
- Controller peripheral expansion
Procurement Notes
Verify the specific manufacturing lot date code and RoHS compliance status prior to procurement, as the component is explicitly noted as non-compliant. Confirm the ceramic package integrity and terminal plating condition. Ensure the supplier provides traceability documentation for the SMSC origin. Check for any obsolescence notices or lifecycle changes from the manufacturer. Validate that the 70 °C thermal limit meets the target system requirements.
Selection Notes
Select this component when a MOS-based micro peripheral interface is required in a ceramic DIP package. Consider the 70 °C maximum operating temperature constraint for environmental suitability. Verify compatibility with existing 14-pin socket or through-hole mounting infrastructure. Evaluate the need for leaded terminals against regulatory constraints. Compare against newer CMOS alternatives if lower power consumption is critical.
Part Context
This part belongs to the SMSC micro peripheral IC family, categorized under embedded processors and controllers. It shares the CDIP14 package style with other legacy components like the COM5046TCD but differs in internal MOS architecture. The series represents older generation interface solutions compared to modern high-speed serial controllers.
Replacement Considerations
Direct pin-compatible replacements may be limited due to the specific MOS technology and ceramic package. Check for updated SMSC successors or generic MOS peripheral ICs in DIP-14 packages. Verify electrical parameter equivalence for voltage levels and signal timing before substitution.
