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The COM2017HCD is a Micro Peripheral IC manufactured by SMSC, classified under embedded processors and controllers. It utilizes MOS technology and is housed in a CDIP14 ceramic dual in-line package with a 2.54 mm pin pitch. The device operates within a commercial temperature range of -40 °C to +85 °C and supports a maximum operating temperature of 70 °C. It features 14 through-hole terminals with a tin/lead (Sn/Pb) finish. The component is not RoHS compliant and lacks formal qualification status.
Verify the specific manufacturing lot date code and lead composition, as the component is explicitly noted as non-RoHS compliant with a tin/lead finish. Confirm the exact temperature grade variant, as specifications indicate both commercial and extended ranges depending on the suffix. Ensure the CDIP14 package dimensions match the target PCB footprint requirements before procurement.
Select this component when a MOS-based micro peripheral interface is required in a ceramic DIP package. Consider the non-RoHS status for compliance with environmental regulations. Verify that the 14-pin dual in-line form factor fits the mechanical constraints of the design. Check if the specific temperature rating meets the operational environment requirements.
This part belongs to the SMSC COM series of micro peripheral integrated circuits. These devices are designed for embedded applications requiring serial or parallel peripheral communication. The COM2017HCD specifically denotes the MOS technology variant in a 14-pin ceramic package, distinguishing it from CMOS versions or plastic packages within the same product family.
Direct replacements must match the CDIP14 package, MOS technology, and pinout. Verify compatibility with the original SMSC datasheet electrical characteristics. Cross-reference with other SMSC COM series parts for pin-compatible alternatives if available.