CPL-WB-01D3

RF Directional Couplers Overview

The CPL-WB-01D3 is a wideband RF directional coupler manufactured by STMicroelectronics. It features an integrated 50 Ohm loaded isolated port, designed for signal conditioning applications in radio frequency systems. The component provides a coupling factor of 26 dB, enabling precise power monitoring and separation within transmission lines. This device supports high-frequency operations typical in modern wireless communication infrastructure.

RF Directional Couplers Feature Summary

• Integrates a 50 Ohm loaded isolated port for enhanced isolation performance
• Provides wideband signal conditioning capabilities across specified frequency ranges
• Functions as a directional coupler with defined coupling characteristics

RF Directional Couplers Applications

• RF signal monitoring in wireless communication systems
• Power measurement and control circuits
• Transmitter output monitoring and protection

RF Directional Couplers Procurement Notes

Verify the current lifecycle status before procurement, as this component may be classified as obsolete or hard-to-find. Confirm availability through authorized distributors or specialized suppliers handling end-of-life products. Ensure that any alternative sourcing methods comply with relevant quality standards and supply chain requirements to maintain system integrity.

RF Directional Couplers Selection Notes

Select this component when wideband directional coupling with an integrated isolated port is required. Consider its specific coupling factor and frequency range compatibility with the target RF system. Evaluate space constraints and integration needs within the circuit design to ensure optimal performance and signal integrity.

RF Directional Couplers Part Context

This part belongs to STMicroelectronics' portfolio of RF components, specifically focusing on signal conditioning and power management solutions. It complements other devices like baluns and filters in complete RF front-end designs. The product line targets applications requiring compact, high-performance passive components for modern wireless technologies.