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Product Detailed Parameters
- Description:.8A 400V TH SCR
- Series:-
- Mfr:Central Semiconductor Corp
- Package:Box
- Voltage - Off State:400 V
- Voltage - Gate Trigger (Vgt) (Max):800 mV
- Current - Gate Trigger (Igt) (Max):200 µA
- Current - Hold (Ih) (Max):5 mA
- Current - Non Rep. Surge 50, 60Hz (Itsm):10A @ 60Hz
- SCR Type:Standard Recovery
- Operating Temperature:-40°C ~ 125°C (TJ)
- Grade:-
- Qualification:-
- Mounting Type:Through Hole
- Package / Case:TO-226-3, TO-92-3 (TO-226AA)
- Supplier Device Package:TO-92-3
- Voltage - On State (Vtm) (Max):1.7 V
- Current - On State (It (AV)) (Max):1:00 AM
- Current - On State (It (RMS)) (Max):800 mA
- Current - Off State (Max):5 µA
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Overview
The CS55D TIN/LEAD is a silicon-controlled rectifier (SCR) manufactured by Central Semiconductor Corp. It features a TO-92-3 through-hole package with tin/lead terminal finish. The device has a repetitive peak off-state voltage of 400 V and a repetitive peak reverse voltage of 400 V.
Feature Summary
- Thyristor switching capability in a compact through-hole form factor
Applications
- Consumer product circuit design
- General-purpose switching applications
Procurement Notes
Verify the specific ordering suffix required for lead plating. Select "TIN/LEAD" for devices with leaded terminals or "PBFREE" for lead-free options when placing orders to ensure compliance with specified material requirements.
Selection Notes
This component is suitable for designs requiring standard recovery characteristics in a small outline package. Engineers should confirm that the 400 V voltage rating aligns with the system's peak voltage constraints before integration.
Part Context
Central Semiconductor manufactures discrete semiconductors including SCRs, diodes, and transistors. The company supplies products in surface mount, through-hole, and bare die formats, focusing on specialized discrete solutions for various electronic applications.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation.
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