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The CSD17556Q5B is an N-channel NexFET power MOSFET manufactured by Texas Instruments. It features a drain-source voltage (Vdss) of 30 V and a continuous drain current (Id) of 34 A at ambient temperature, scaling to 100 A at case temperature. The device exhibits a maximum on-resistance (Rds On) of 1.4 milliohms at 10 V gate drive with 40 A current. Key electrical parameters include a maximum gate charge (Qg) of 39 nC at 4.5 V, a threshold voltage (Vgs(th)) of 1.65 V at 250 µA, and an input capacitance (Ciss) of 7020 pF at 15 V. Power dissipation ratings are 3.1 W at ambient and 191 W at case temperatures. The component operates within a junction temperature range of -55°C to 150°C and utilizes an 8-VSON-CLIP package.
Verify the specific ordering suffix to ensure the correct tape and reel configuration matches your assembly requirements. Confirm that the RoHS status aligns with environmental compliance standards for your target market. Check the moisture sensitivity level and recommended reflow profile to prevent damage during surface mount processing. Ensure the supplier provides valid traceability documentation for quality assurance purposes.
Select this component when a 30 V rating is sufficient and low conduction losses are critical. The high current capability supports compact designs requiring significant power handling in small footprints. Evaluate the thermal resistance characteristics against your system's cooling strategy. Compare the gate charge specifications against your driver capabilities to optimize switching speed and minimize losses.
This part belongs to the CSD17556 series from Texas Instruments, designed as a single N-channel enhancement mode field-effect transistor. It is housed in an 8-PowerTDFN package variant known as 8-VSON-CLIP, which measures 5x6 mm. The series targets applications demanding high efficiency and robust performance in power conversion environments.
Consult official substitution guides for compatible alternatives within the same voltage and current class. Verify pinout compatibility and thermal performance metrics before replacing the original component.