Full Half-Bridge (H Bridge) Drivers CSD95378BQ5M product image

CSD95378BQ5M

$3.82
  • Description:IC HALF BRIDGE DRIVER 60A 12LSON
  • Series:NexFET™
  • Mfr:Texas Instruments
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:11acb4fd9878 Category: Brand:

  
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CSD95378BQ5M is listed in the Full Half-Bridge (H Bridge) Drivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC HALF BRIDGE DRIVER 60A 12LSON. Review the specifications below when checking this part for your BOM.

Full Half-Bridge (H Bridge) Drivers specifications for CSD95378BQ5M

  • Description:IC HALF BRIDGE DRIVER 60A 12LSON
  • Series:NexFET™
  • Mfr:Texas Instruments
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Output Configuration:Half Bridge
  • Applications:Synchronous Buck Converters
  • Interface:PWM
  • Load Type:Inductive
  • Technology:Power MOSFET
  • Rds On (Typ):-
  • Current - Output / Channel:60A
  • Current - Peak Output:90A
  • Voltage - Supply:4.5V ~ 5.5V
  • Voltage - Load:4.5V ~ 16V
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Features:Bootstrap Circuit, Status Flag
  • Fault Protection:Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO
  • Mounting Type:Surface Mount
  • Package / Case:12-PowerLFDFN
  • Supplier Device Package:12-LSON-CLIP (5x6)
  • Grade:-
  • Qualification:-

Full Half-Bridge (H Bridge) Drivers datasheet and documents for CSD95378BQ5M

CSD95378BQ5M

Full Half-Bridge (H Bridge) Drivers Overview

The CSD95378BQ5M is a NexFET intelligent power stage from Texas Instruments, integrating a high-side and low-side synchronous buck converter with gate drivers in a compact LSON-CLIP-12 package. It operates within a supply voltage range of 4.5 V to 5.5 V and supports continuous output currents up to 60 A. The device features an integrated bootstrap diode and thermal pad for efficient heat dissipation, designed for high-density power applications requiring minimal external component count.

Full Half-Bridge (H Bridge) Drivers Feature Summary

  • Integrates high-side and low-side N-channel MOSFETs with dedicated gate drivers into a single monolithic structure.
  • Includes an internal bootstrap diode to simplify circuit design and reduce external component requirements.
  • Features a thermally enhanced LSON-CLIP package with an exposed copper clip for superior thermal performance.

Full Half-Bridge (H Bridge) Drivers Applications

  • Point-of-load (POL) converters for central processing units (CPUs)
  • Graphics processing unit (GPU) power delivery stages
  • High-current memory and FPGA power regulation

Full Half-Bridge (H Bridge) Drivers Procurement Notes

Verify the exact suffix BQ5M against the manufacturer's official datasheet to confirm pinout and electrical specifications. Ensure compatibility with the target PCB footprint for the LSON-CLIP-12 package. Confirm moisture sensitivity level and reflow soldering profile requirements prior to assembly to prevent package damage during manufacturing.

Full Half-Bridge (H Bridge) Drivers Selection Notes

Select this component when designing synchronous buck converters requiring high current density and minimal board space. The integrated driver and bootstrap diode reduce bill of materials complexity. Evaluate thermal resistance characteristics relative to the application's cooling constraints. Ensure the input voltage source remains stable within the specified 4.5 V to 5.5 V operating range for reliable operation.

Full Half-Bridge (H Bridge) Drivers Part Context

This part belongs to Texas Instruments' NexFET intelligent power stage family, which combines power switches and control logic. These modules are engineered to replace discrete MOSFET and driver solutions, offering improved efficiency and reduced electromagnetic interference. The CSD95378BQ5M specifically targets high-performance computing and graphics power architectures.

Full Half-Bridge (H Bridge) Drivers Replacement Considerations

Consult the official TI product selection guide for direct replacements within the CSD9537x series. Verify pin-to-pin compatibility and thermal characteristics before substituting with other NexFET stages or discrete components.

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