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CSRA67074DA01-CPSC-T is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists Qualcomm. Its product description is SOC AUDIO PROCESSOR 144LQFP. Review the specifications below when checking this part for your BOM.
The Qualcomm CSRA67074DA01-CPSC-T is a System-on-Chip (SoC) designed for Bluetooth audio applications. It integrates a high-performance ARM Cortex-M3 processor core with dedicated digital signal processing capabilities optimized for audio codecs and wireless protocols. The device supports Bluetooth v5.2 specifications, enabling efficient data transmission and low-latency communication. It features integrated memory structures to support firmware execution and data buffering. The SoC includes multiple General Purpose Input/Output (GPIO) pins for peripheral connectivity and system control. Power management units are embedded to optimize energy consumption across various operational states, ensuring extended battery life in portable devices.
Verify the exact ordering part number against the manufacturer's official datasheet to ensure compatibility with specific package variants and temperature grades. Confirm that the CPSC suffix aligns with the required tape-and-reel packaging configuration for surface-mount assembly processes. Cross-reference the revision level with current firmware support documentation to guarantee software compatibility.
Select this component when designing Bluetooth audio solutions requiring a balance of processing power and low power consumption. Evaluate the integration of the Cortex-M3 core against external microcontroller requirements to simplify the bill of materials. Assess the GPIO availability against interface needs for buttons, LEDs, or charging circuits before finalizing the design.
This SoC belongs to Qualcomm's CSR867x family of Bluetooth audio processors. These components are widely utilized in consumer electronics where compact form factors and reliable wireless audio streaming are critical. The family represents a transition towards more integrated solutions that combine baseband, RF, and application processing into a single silicon die.
Publicly confirmed direct substitute part numbers are not available in the provided source material. Engineering changes may require re-evaluation of the antenna design, firmware adaptation, and peripheral circuitry due to potential differences in pinout or internal register configurations.
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