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CSTLS20M0X51-B0 is listed in the Resonators range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is CERAMIC RES 20.0000MHZ 5PF T/H. Review the specifications below when checking this part for your BOM.
The Murata CSTLS20M0X51-B0 is a ceramic resonator operating at 20 MHz with ±0.5% initial frequency tolerance and ±0.2% stability. It features a built-in load capacitance of 5 pF, designed for third-harmonic oscillation modes. The component utilizes through-hole mounting with three leads spaced at a 2.50 mm pitch. Physical dimensions are defined by a length of 6.5 mm, width of 3.5 mm, and height of 5.5 mm. It operates within a temperature range of -20°C to +80°C and complies with RoHS and REACH standards.
Verify the specific suffix designation against official documentation to confirm electrical parameters, as variations may exist within the product family. Ensure compatibility with existing PCB footprints regarding lead pitch and physical dimensions. Confirm that the integrated 5 pF load capacitance aligns with the target oscillator circuit requirements before integration into the design.
Select this component when a precise 20 MHz reference is required with minimal external passive components. The built-in 5 pF capacitance distinguishes it from other variants requiring different load values. Consider the through-hole package constraints and thermal operating limits when evaluating placement within the assembly process and environmental conditions.
This part belongs to the CERALOCK series, representing Murata's ceramic resonator line. These devices combine piezoelectric elements with integrated capacitors to offer a cost-effective alternative to crystal oscillators. The CSTLS20M0X51-B0 specifically targets applications needing moderate frequency accuracy without the complexity of external tuning networks.
Direct substitutes include other Murata ceramic resonators with identical 20 MHz frequency, 5 pF load capacitance, and through-hole packaging. Verify mechanical footprint compatibility and lead spacing when considering cross-brand alternatives to ensure seamless board integration.
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