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CT-H0-0473 REV 0B is an extruded aluminum heatsink manufactured by Boyd Laconia, LLC. Designed for board-level vertical mounting, it features a rectangular fin structure with black anodized finish. The component measures 2.500 inches (63.50mm) in length and 1.650 inches (41.91mm) in width, with a fin height of 1.000 inch (25.40mm). It provides a thermal resistance of 8.00°C/W under natural convection conditions and 2.00°C/W at 300 LFM airflow. The unit is rated to dissipate 20.0W at a 60°C temperature rise and utilizes screw and pin mounting methods.
Verify the exact revision suffix 'REV 0B' against official Boyd Laconia documentation to ensure compatibility with specific mechanical interfaces. Confirm that the TO-218 package footprint matches the target device dimensions. Check for any updated datasheets regarding thermal performance variations or material specifications before finalizing procurement orders.
Select this heatsink when a vertical board-level solution is required for TO-218 packages. Ensure the application environment supports the specified thermal resistance values. Verify that the mounting method aligns with the system's mechanical constraints. Consider airflow requirements if operating near the 300 LFM limit for optimal thermal performance.
This component belongs to the standard heatsink catalog from Boyd Laconia, LLC. It is part of their portfolio of engineered thermal management solutions. The product line focuses on providing reliable heat dissipation for electronic components through standardized designs.
Consult official Boyd Laconia substitution guides for verified alternatives. Ensure replacement parts maintain identical mounting dimensions and thermal characteristics.