CT0402HPF-47NG

Fixed Inductors Overview

The CT0402HPF-47NG is a surface-mount wire-wound chip inductor from Central Technologies, housed in a standard 0402 (1005 metric) package. It features a nominal inductance of 47 nH with a tolerance code 'N' indicating ±5%. The component has a maximum DC resistance of 0.6 ohms and a self-resilient frequency of 3000 MHz. It operates within a temperature range of -40°C to +125°C and supports a maximum rated current of 0.28 A.

Fixed Inductors Feature Summary

• Utilizes a ceramic core construction for stable RF performance
• Designed for high-frequency applications with a 3000 MHz self-resonant frequency
• Compliant with RoHS standards and halogen-free environmental requirements

Fixed Inductors Applications

• RF circuit filtering
• Impedance matching networks
• High-frequency signal processing

Fixed Inductors Procurement Notes

Verify the specific tolerance suffix 'N' corresponds to the required ±5% accuracy for your design. Confirm that the 0.6 ohm DC resistance and 0.28 A current rating meet the power handling requirements of the target application. Ensure the 0402 footprint aligns with the PCB layout constraints.

Fixed Inductors Selection Notes

Select this component when a compact 0402 form factor is required for 47 nH inductance. Consider the 3000 MHz self-resonant frequency limit for high-speed signals. Compare against the CTTF series if tighter tolerances or different Q factors are needed, noting the distinct electrical characteristics of the HPF line.

Fixed Inductors Part Context

This part belongs to the CT0402HPF series of low-profile chip inductors manufactured by Central Technologies. The series offers various inductance values ranging from 1.0 nH to 68 nH, all sharing the same 0402 package dimensions and general structural specifications while varying in electrical parameters.

Fixed Inductors Replacement Considerations

Direct substitutes include other 0402 wire-wound inductors with 47 nH nominal value and similar current ratings. Verify compatibility with existing PCB footprints and thermal management strategies before swapping manufacturers.