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CT0603CSF-5N1J is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Central Technologies. Its product description is SMD CER CORE WIRE-WOUND INDUCTOR. Review the specifications below when checking this part for your BOM.
The CT0603CSF-5N1J is a fixed wire-wound inductor from Central Technologies, designed for surface-mount applications. It features a ceramic core and operates within the standard 0603 package footprint. The component provides an inductance of 0.0051 µH with a tolerance of ±5%. It has a maximum rated current of 0.7 A and a DC resistance of 0.14 Ω. The unit supports a quality factor of 20 at 250 MHz and functions reliably across a temperature range of -40 °C to 125 °C.
Verify that the ordering suffix matches the required tolerance code, specifically 'J' for ±5% accuracy. Confirm the component meets RoHS compliance requirements for your assembly process. Ensure the 0603 package dimensions align with your PCB layout constraints. Check that the 0.7 A current rating satisfies the operational load conditions of the target circuit design.
Select this component when a low-value inductance near 5 nH is required in a compact 0603 form factor. The ceramic core construction offers stability suitable for general-purpose applications. Consider the 0.7 A current limit and 0.14 Ω DC resistance when designing power or signal paths. This part is appropriate for designs prioritizing standard surface-mount compatibility over specialized high-frequency characteristics.
This model belongs to the CT0603CSF series of wire-wound chip inductors manufactured by Central Technologies. The series covers a wide range of values from 1.6 nH to 390 nH. These components are characterized by their open construction style and ceramic core materials, providing a versatile solution for various electronic circuit implementations requiring small passive inductive elements.
Cross-reference other 0603 wire-wound inductors with 5.1 nH nominal value and ±5% tolerance. Verify equivalent DC resistance and current handling capabilities before substitution. Ensure the replacement part maintains compatible thermal ratings and physical footprint dimensions for direct board integration.
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