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CT0603CSF-6N2J is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Central Technologies. Its product description is SMD CER CORE WIRE-WOUND INDUCTOR. Review the specifications below when checking this part for your BOM.
The CT0603CSF-6N2J is a general-purpose wire-wound chip inductor manufactured by Central Technologies. It features a ceramic core and is designed for surface-mount applications in the 0603 package. The component has a nominal inductance of 6.2 nH with a tolerance of ±2%. It exhibits a maximum DC resistance of 144 mΩ and supports a maximum rated current of 0.7 A. The device operates within a temperature range of -40°C to +125°C and complies with RoHS standards.
Verify that the ordering suffix 'J' corresponds to the required ±2% tolerance as specified in the manufacturer's documentation. Confirm that the 0603 package dimensions align with the target PCB layout constraints. Ensure the selected variant meets the specific inductance value of 6.2 nH for the intended frequency response requirements.
Select this component when a low-inductance, high-current solution is required for RF or power filtering applications. The ceramic core provides stability against saturation compared to iron powder alternatives. Consider the 0603 size for board space optimization while ensuring the 0.7 A current rating exceeds the peak operational current of the circuit.
This part belongs to the CT0603CSF series from Central Technologies, which offers a wide range of fixed inductances from 1.6 nH to 390 nH. The series utilizes wire-wound technology on ceramic cores, providing consistent performance across various high-frequency applications. The product line is designed to meet modern electronics demands for compact, reliable passive components.
Cross-reference with other 0603 ceramic-core wire-wound inductors offering 6.2 nH ±2% tolerance. Verify that substitute parts match the 144 mΩ max DC resistance and 0.7 A current rating. Ensure thermal and mechanical specifications are compatible with the existing assembly process.
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