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CT0603CSF-R18J is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Central Technologies. Its product description is SMD CER CORE WIRE-WOUND INDUCTOR. Review the specifications below when checking this part for your BOM.
The CT0603CSF-R18J is a fixed surface-mount inductor manufactured by Central Technologies. It features a ceramic core and wire-wound construction within a 0603 rectangular package. The component provides an inductance of 180 nH with a tolerance of ±5%. Key electrical parameters include a DC resistance of 1.25 Ω, a self-resolving frequency of 990 MHz, and a quality factor of 25 at the nominal inductance. It supports a maximum rated current of 240 mA and operates within a temperature range of -40°C to 125°C.
Verify the specific suffix 'R18J' to confirm the 180 nH value and 5% tolerance. Ensure the procurement order specifies the tape and reel packaging format if required for high-volume production lines. Confirm that the operating environment remains within the specified -40°C to 125°C thermal limits during final system integration.
Select this component when a compact 0603 footprint is required for low-inductance applications. The ceramic core offers stability compared to air cores, while the wire-wound design supports higher Q factors than ferrite alternatives. Consider the 240 mA current limit and 1.25 Ω DCR when designing power-sensitive circuits or tight voltage drop constraints.
This part belongs to the CT0603CSF series of chip inductors from Central Technologies. The series utilizes ceramic cores to provide consistent electrical characteristics across varying environmental conditions. The 0603 form factor allows for dense PCB layouts in consumer electronics and communication devices requiring small passive components.
Direct substitutes must match the 180 nH inductance, 0603 package dimensions, and similar DC resistance values. Verify that alternative manufacturers offer comparable self-resonant frequencies and current ratings to ensure circuit compatibility without redesign.
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