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CTMMP1808AF-220M is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Central Technologies. Its product description is SMD Shielded Power Inductor. Review the specifications below when checking this part for your BOM.
The CTMMP1808AF-220M is a shielded surface-mount power inductor manufactured by Central Technologies. It features a nominal inductance of 22 µH with a tolerance of ±20%. The component utilizes a ferrite core and is housed in a compact SMD package measuring 4.45 mm in length and 4.06 mm in width. Designed for high reliability, it complies with RoHS standards and is suitable for applications requiring magnetic shielding to minimize electromagnetic interference.
Verify the specific part number suffix against official Central Technologies documentation to confirm exact tolerance and compliance status. Ensure that the ordering specifications match the required inductance value and physical dimensions for the target PCB layout. Cross-reference the manufacturer's latest datasheet to confirm current availability and any potential obsolescence notices before finalizing procurement plans.
Select this component when a shielded SMD inductor with a 22 µH nominal value is required. The 1808 footprint offers a balance between current handling capability and board space efficiency. Consider the ±20% tolerance for circuit design margins. Verify thermal performance requirements against the rated current specifications provided in the official datasheet to ensure stable operation under load conditions.
This part belongs to the CTMMP series of shielded power inductors from Central Technologies. The series provides various inductance values within the same physical footprint, allowing for design flexibility. The 'AF' suffix typically denotes specific material or compliance characteristics defined by the manufacturer. This series is engineered for modern electronics requiring compact, reliable passive components.
Consult the official Central Technologies replacement guide for direct equivalents. Verify that any substitute component matches the 1808 package dimensions, 22 µH inductance, and shielding requirements. Ensure compatibility with existing PCB footprints and thermal management strategies before implementing any alternative parts.
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