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CTMMP6826AF-330M is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Central Technologies. Its product description is SMD Shielded Power Inductor. Review the specifications below when checking this part for your BOM.
The CTMMP6826AF-330M is a fixed shielded inductor from the Central Technologies CTMMP6826AF series. It features a nominal inductance of 33 µH with a ±20% tolerance. The component is designed for high-current applications, offering an RMS current rating of 1.5 A and saturation current ratings of 1.5 A (Isat 1) and 1.5 A (Isat 2). It exhibits a maximum DC resistance of 470 mΩ. The device utilizes a surface-mount package suitable for automated assembly processes.
Verify the specific electrical parameters against the official Central Technologies datasheet prior to procurement. Confirm that the required inductance tolerance and current ratings align with the circuit design specifications. Ensure the surface-mount footprint matches the target PCB layout. Request samples for validation if necessary.
Select this component when a 33 µH inductance value is required with moderate current handling capabilities. Consider the 470 mΩ DC resistance impact on efficiency. Evaluate the physical size constraints against available board space. Compare performance against alternative shielded inductors if higher current or lower resistance is needed.
This part belongs to the CTMMP6826AF series of fixed inductors manufactured by Central Technologies. The series provides shielded components designed for power electronics applications. The 'M' suffix indicates the inductance value and tolerance, while 'AF' denotes the specific series characteristics. These components are intended for use in compact power supply designs.
Consult the official Central Technologies documentation for verified substitute part numbers. Cross-reference specifications such as inductance, current ratings, and physical dimensions when evaluating alternatives. Ensure any replacement maintains compatibility with the existing PCB footprint and thermal requirements.
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