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CTMPC080604F-R56M is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Central Technologies. Its product description is 0.56UH SMD SHLDED POWER INDUCTOR. Review the specifications below when checking this part for your BOM.
The CTMPC080604F-R56M is a shielded surface-mount power inductor from Central Technologies, featuring an inductance of 0.56 µH with ±20% tolerance. It utilizes a molded construction within an 0806 package footprint measuring 2.00mm x 1.60mm. Designed for general-purpose applications, this component operates as a single-element device suitable for DC current handling in compact electronic circuits.
Verify the specific manufacturer datasheet for precise DC resistance values and saturation current ratings before finalizing procurement decisions. Confirm that the 0806 package dimensions align with the target PCB layout constraints. Ensure compliance with RoHS standards if required by the end-product specifications. Cross-reference the part number against official distributor catalogs to confirm availability and authenticity.
Select this component when space-constrained designs require a shielded inductor with moderate inductance values. The 0806 footprint offers a balance between size and current handling capabilities compared to smaller packages. Consider the ±20% tolerance for circuit design margins. Evaluate thermal performance requirements against the component's physical size and material properties.
This model belongs to the CTMPC series of shielded power inductors manufactured by Central Technologies. The series provides various inductance options within the 0806 surface-mount form factor. These components are engineered for reliability in consumer electronics and industrial applications requiring efficient magnetic shielding and stable electrical performance under varying load conditions.
Consult official manufacturer substitution guides or cross-reference databases for verified equivalent parts. Ensure replacement components match the 0806 footprint, 0.56 µH inductance, and shielding characteristics. Verify compatibility with existing PCB layouts and thermal management strategies before implementing any alternative sourcing options.
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