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CTSFW1365F-4R7M is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Central Technologies. Its product description is SMD SHIELDED POWER INDUCTOR. Review the specifications below when checking this part for your BOM.
The CTSFW1365F-4R7M is a shielded surface-mount power inductor manufactured by Central Technologies. It features a fixed inductance of 4.7 µH and supports a saturation current of 13 A. The component utilizes a flat wire construction to achieve low DC resistance, ensuring efficient power conversion in compact designs. Designed for high-current applications, it offers reliable performance within standard operating temperature ranges while maintaining electromagnetic interference shielding.
Verify the specific suffix designation against the manufacturer's official datasheet to confirm exact electrical tolerances and packaging specifications. Ensure that the procurement channel provides traceable documentation matching the Central Technologies part number. Cross-reference the requested quantity with available stock levels from authorized distributors to prevent supply chain delays during production runs.
Select this component when designing circuits requiring a 4.7 µH inductance value with a minimum 13 A current rating. Evaluate the physical footprint constraints against the SMD package dimensions to ensure adequate board space. Consider thermal management requirements based on the expected DC resistance and ambient operating conditions to maintain efficiency.
This component belongs to the CTSFW series of shielded power inductors from Central Technologies. The series is characterized by robust construction suitable for industrial and commercial power electronics. It complements other fixed inductor offerings in the manufacturer's portfolio designed for high-efficiency energy storage applications.
Direct substitutes include the HFMP1365-4R7M from Fengjui Technology and the CTHFW2915F-4R7M, which share similar inductance values. Verify pin compatibility and mechanical dimensions before integration to ensure seamless replacement without redesigning the printed circuit board layout.
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